Entegris, Inc.

BILLERICA, Mass.--(BUSINESS WIRE)--Entegris, Inc. today announced an expansion of its strategic partnership with Kioxia Corporation to accelerate materials innovation for future generations of BiCS FLASH™ 3D flash memory and next-generation computing. As artificial intelligence expands across data centers, enterprise systems and edge computing, memory is becoming increasingly important to system performance and power efficiency. Future memory architectures will require advances in device design.

BILLERICA, Mass.--(BUSINESS WIRE)--Entegris, Inc. (Nasdaq: ENTG), a leading supplier of critical advanced materials and process solutions for the semiconductor and other high-technology industries, today announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging. “Growth in AI compute, from model training to inference, is intensifying power and heat-m.

ENTG, CNXN and BLCO made it to the Zacks Rank #1 (Strong Buy) momentum stocks list on November 2, 2026.

Entegris (NASDAQ: ENTG) reported record third-quarter 2026 revenue of $1.006 billion, up 25% from a year earlier and 14% sequentially, as demand strengthened across advanced logic, advanced memory and semiconductor capital-equipment markets. CEO Dave Reeder said the company benefited from continued investment in artificial-intelligence infrastructure, increasing semiconductor process complexity and improved internal execution. He said Entegris