Market-differentiated ELSFP technology extends core photonics platform of MicroVision's Scantinel division into high-speed optical connectivity and photonic-enabled cloud computing REDMOND, WA / ACCESS Newswire / September 22, 2026 / MicroVision, Inc. (NASDAQ:MVIS), a leader in advanced perception solutions for industrial, security and defense, and automotive applications today announced the introduction by its wholly owned Scantinel subsidiary of an advanced photonics solution designed to address power efficiency and performance challenges critical for next-generation AI data center scale-up architectures and other intelligent infrastructure applications. As the global photonics community gathers in Málaga, Spain this week for the 52nd European Conference on Optical Communication and the Global Photonics Economic Forum, Scantinel revealed its new external laser small form-factor pluggable (ELSFP) module that provides a centralized, serviceable light source for co-packaged optics (CPO) systems in existing and next-generation AI data centers and photonics-enabled AI and cloud infrastructure.
