Synopsys, Inc.

New collaborations span A14 design enablement, AI-assisted engineering workflows, CoWoS® support for multi-die designs, and unified multiphysics signoff Certified EDA flows on TSMC A14 accelerate design readiness for next-generation AI and HPC applications Collaboration on agentic AI workflows accelerates automation and improves productivity for complex analog, digital, and multi-die designs Continued enablement for IVR multi-die designs on TSMC CoWoS® technology addresses power integrity and thermal requirements for AI systems Continued joint enablement for TSMC-COUPE™ streamlines co-packaged optics development and verification Expanded 2nm IP portfolio and tape-out milestones including for PCIe 7.0 and HBM4 speed the development of differentiated AI, data center, edge, and automotive products SUNNYVALE, Calif., Sept. 23, 2026 /PRNewswire/ -- Synopsys (Nasdaq: SNPS) today announced new innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems.

CDNS' new RTL Generation Agent automates chip design and optimization, delivering 24% lower area and 18% lower power in early evaluations.

Chip design complexity is hitting levels only a handful of software vendors can handle, and one under-the-radar name keeps collecting a toll on every advanced design that ships.

The mean of analysts' price targets for Synopsys (SNPS) points to a 37.4% upside in the stock. While this highly sought-after metric has not proven reasonably effective, strong agreement among analysts in raising earnings estimates does indicate an upside in the stock.