CEVA, Inc.

Long-standing collaboration combines Ceva-Waves Bluetooth Low Energy IP with NSING Technologies' RF and MCU expertise to enable connected devices across consumer, automotive and industrial markets SHANGHAI, Nov. 5, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that NSING Technologies, a leading provider of microcontrollers and semiconductor solutions, has surpassed 250 million Bluetooth chips shipped incorporating Ceva-Waves Bluetooth Low Energy (LE) IP. The milestone highlights the success of the companies' long-standing collaboration and the widespread adoption of NSING Technologies' Bluetooth-enabled products across wearables, consumer electronics, smart home, automotive and industrial applications.

Early investment in Bluetooth HDT, integrated RF capabilities and proven interoperability drive strong commercial momentum, with more than ten customers already licensing Ceva's technology ROCKVILLE, Md., Nov. 4, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today welcomed the introduction of Bluetooth® High Data Throughput (HDT), the next major advancement in Bluetooth technology.

IPnest ranks Ceva #1 in wireless interface IP with approximately 68% market share, 12 times that of the next-largest vendor, as the category grows approximately 14% HSINCHU COUNTY, Taiwan, Nov. 2, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that powers the Smart Edge, today announced that it retained the #1 position in wireless interface IP in IPnest's September 2026 Design IP report . As AI expands across billions of connected devices, reliable, ultra-low-power wireless connectivity becomes essential for sharing data and context across them.

First production deployment of Ceva's NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices ROCKVILLE, Md. and SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ -- As AI becomes embedded across the physical world, workloads are increasingly being processed where they can run most effectively and efficiently, from the cloud to the device itself.